List of AMD mobile processors

Features overview

CPUs

APUs

APU features table

Initial platform (2003)

Launched in 2003, the initial platform for mobile AMD processors consists of:

AMD mobile Initial platform
Mobile processor Processors – Socket 754
Mobile chipset D-sub and HyperTransport 1.0

Mobile Sempron

"Dublin" (Socket 754, CG, 130 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

Model Number Frequency L2 Cache HyperTransport Mult.2 Voltage TDP Release Date Part Number(s)
Mobile Sempron 2600+ 1600 MHz 128 kB 800 MHz 8x 0.95 – 1.4 V 13 – 62 W July 28, 2004 SMN2600BIX2AY
Mobile Sempron 2800+ 1600 MHz 256 kB 800 MHz 8x 0.95 – 1.4 V 13 – 62 W July 28, 2004 SMN2800BIX3AY
Mobile Sempron 3000+ 1800 MHz 128 kB 800 MHz 9x 0.95 – 1.4 V 13 – 62 W July 28, 2004 SMN3000BIX2AY

"Dublin" (Socket 754, CG, 130 nm, Low power)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

Model Number Frequency L2 Cache HyperTransport Mult.2 Voltage TDP Release Date Part Number(s)
Mobile Sempron 2600+ 1600 MHz 128 kB 800 MHz 8x 0.975 – 1.25 V 9 – 25 W July 28, 2004 SMS2600BOX2LA
Mobile Sempron 2800+ 1600 MHz 256 kB 800 MHz 8x 0.975 – 1.25 V 9 – 25 W July 28, 2004 SMS2800BOX3LA

"Georgetown" (Socket 754, D0, 90 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

Model Number Frequency L2 Cache HyperTransport Mult.2 Voltage TDP Release Date Part Number(s)
Mobile Sempron 2600+ 1600 MHz 128 kB 800 MHz 8x 0.95 – 1.4 V 62 W July 2004 SMN2600BIX2BA
Mobile Sempron 2800+ 1600 MHz 256 kB 800 MHz 8x 0.95 – 1.4 V 62 W July 2004 SMN2800BIX3BA
Mobile Sempron 3000+ 1800 MHz 128 kB 800 MHz 9x 0.95 – 1.4 V 62 W July 2004 SMN3000BIX2BA
Mobile Sempron 3100+ 1800 MHz 256 kB 800 MHz 9x 0.95 – 1.4 V 62 W May 3, 2005 SMN3100BIX3BA
Mobile Sempron 3300+ 2000 MHz 128 kB 800 MHz 10x 0.95 – 1.4 V 62 W August 19, 2005 SMN3300BIX2BA

"Sonora" (Socket 754, D0, 90 nm, Low power)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

Model Number Frequency L2 Cache HyperTransport Mult.2 Voltage TDP Release Date Part Number(s)
Mobile Sempron 2600+ 1600 MHz 128 kB 800 MHz 8x 0.975 – 1.25 V 25 W July 2004 SMS2600BOX2LB
Mobile Sempron 2800+ 1600 MHz 256 kB 800 MHz 8x 0.975 – 1.25 V 25 W July 2004 SMS2800BOX3LB
Mobile Sempron 3000+ 1800 MHz 128 kB 800 MHz 9x 0.975 – 1.25 V 25 W November 23, 2004 SMS3000BOX2LB
Mobile Sempron 3100+ 1800 MHz 256 kB 800 MHz 9x 0.975 – 1.25 V 25 W January 2005 SMS3100BOX3LB

"Albany" (Socket 754, E6, 90 nm, Desktop replacement)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit

Model Number Frequency L2 Cache HyperTransport Mult.2 Voltage TDP Release Date Part Number(s)
Mobile Sempron 3000+ 1800 MHz 128 kB 800 MHz 9x 0.95 – 1.4 V 62 W July 15, 2005 SMN3000BIX2BX
Mobile Sempron 3100+ 1800 MHz 256 kB 800 MHz 9x 0.95 – 1.4 V 62 W July 15, 2005 SMN3100BIX3BX
Mobile Sempron 3300+ 2000 MHz 128 kB 800 MHz 10x 0.95 – 1.4 V 62 W July 15, 2005 SMN3300BIX2BX
Mobile Sempron 3400+ 2000 MHz 256 kB 800 MHz 10x 0.95 – 1.4 V 62 W January 23, 2006 SMN3400BIX3BX
Mobile Sempron 3600+ 2200 MHz 128 kB 800 MHz 11x 0.95 – 1.4 V 62 W May 17, 2006 SMN3600BIX2BX

"Roma" (Socket 754, E6, 90 nm, Low power)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit

Model Number Frequency L2 Cache HyperTransport Mult.2 Voltage TDP Release Date Part Number(s)
Mobile Sempron 2800+ 1600 MHz 256 kB 800 MHz 8x 0.95 – 1.2 V 25 W July 15, 2005 SMS2800BQX3LF
Mobile Sempron 3000+ 1800 MHz 128 kB 800 MHz 9x 0.95 – 1.2 V 25 W July 15, 2005 SMS3000BQX2LE
SMS3000BQX2LF
Mobile Sempron 3100+ 1800 MHz 256 kB 800 MHz 9x 0.95 – 1.2 V 25 W July 15, 2005 SMS3100BQX3LE
Mobile Sempron 3300+ 2000 MHz 128 kB 800 MHz 10x 0.95 – 1.2 V 25 W July 2005 SMS3300BQX2LE
Mobile Sempron 3400+ 2000 MHz 256 kB 800 MHz 10x 0.95 – 1.2 V 25 W May 17, 2006 SMS3400BQX3LE

Mobile Athlon 64

"ClawHammer" (C0 & CG, 130 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Socket Release Date Part Number(s)
Mobile Athlon 64 2700+ 1600 MHz 512 kB 800 MHz 8x 1.50 V 19 – 81.5 W Socket 754 May 2004 AMA2700BEY4AP (C0)
Mobile Athlon 64 2800+ 1600 MHz 1024 kB 800 MHz 8x 1.50 V 19 – 81.5 W Socket 754 February 2004 AMA2800BEX5AP (C0)
AMA2800BEX5AR (CG)
Mobile Athlon 64 3000+ 1800 MHz 1024 kB 800 MHz 9x 1.50 V 19 – 81.5 W Socket 754 September 2003 AMA3000BEX5AP (C0)
AMA3000BEX5AR (CG)
Mobile Athlon 64 3200+ 2000 MHz 1024 kB 800 MHz 10x 1.50 V 19 – 81.5 W Socket 754 September 2003 AMA3200BEX5AP (C0)
AMA3200BEX5AR (CG)
Mobile Athlon 64 3400+ 2200 MHz 1024 kB 800 MHz 11x 1.50 V 19 – 81.5 W Socket 754 September 2003 AMA3400BEX5AP (C0)
AMA3400BEX5AR (CG)
Mobile Athlon 64 3700+ 2400 MHz 1024 kB 800 MHz 12x 1.50 V 19 – 81.5 W Socket 754 September 2003 AMA3700BEX5AP (C0)
AMA3700BEX5AR (CG)

"ClawHammer" (C0 & CG, 130 nm, 62 W TDP)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Socket Release Date Part Number(s)
Mobile Athlon 64 2800+ 1600 MHz 1024 kB 800 MHz 8x 1.40 V 62 W Socket 754 September 2003 AMN2800BIX5AP (C0)
AMN2800BIX5AR (CG)
Mobile Athlon 64 3000+ 1800 MHz 1024 kB 800 MHz 9x 1.40 V 62 W Socket 754 September 2003 AMN3000BIX5AP (C0)
AMN3000BIX5AR (CG)
Mobile Athlon 64 3200+ 2000 MHz 1024 kB 800 MHz 10x 1.40 V 62 W Socket 754 September 2003 AMN3200BIX5AP (C0)
AMN3200BIX5AR (CG)
Mobile Athlon 64 3400+ 2200 MHz 1024 kB 800 MHz 11x 1.40 V 62 W Socket 754 February 2004 AMN3400BIX5AR (CG)

"ClawHammer" (CG, 130 nm, 35 W TDP)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Socket Release Date Part Number(s)
Mobile Athlon 64 2700+ 1600 MHz 512 kB 800 MHz 8x 1.20 V 35 W Socket 754 May 2004 AMD2700BQX4AR

"Odessa" (CG, 130 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Socket Release Date Part Number(s)
Mobile Athlon 64 2800+ 1800 MHz 512 kB 800 MHz 8x 1.50 V 19 – 81.5 W Socket 754 April 2004 AMA2800BEX4AX

"Odessa" (CG, 130 nm, 35 W TDP)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Socket Release Date Part Number(s)
Mobile Athlon 64 2700+ 1600 MHz 512 kB 800 MHz 8× 1.20 V 35 W Socket 754 May 2004 AMD2700BQX4AX
Mobile Athlon 64 2800+ 1800 MHz 512 kB 800 MHz 9× 1.20 V 35 W Socket 754 May 2004 AMD2800BQX4AX
Mobile Athlon 64 3000+ 2000 MHz 512 kB 800 MHz 10× 1.20 V 35 W Socket 754 May 2004 AMD3000BQX4AX

"Oakville" (D0, 90 nm, 35 W TDP Low Power)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Socket Release Date Part Number(s)
Mobile Athlon 64 2700+ 1600 MHz 512 kB 800 MHz 8× 1.35 V 35 W Socket 754 August 17, 2004 AMD2700BKX4LB
Mobile Athlon 64 2800+ 1800 MHz 512 kB 800 MHz 9× 1.35 V 35 W Socket 754 August 17, 2004 AMD2800BKX4LB
Mobile Athlon 64 3000+ 2000 MHz 512 kB 800 MHz 10× 1.35 V 35 W Socket 754 August 17, 2004 AMD3000BKX4LB

"Newark" (E5, 90 nm, 62 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Socket Release Date Part Number(s)
Mobile Athlon 64 3000+ 1800 MHz 1024 kB 800 MHz 9× 1.35 V 62 W Socket 754 April 14, 2005 AMN3000BKX5BU
Mobile Athlon 64 3200+ 2000 MHz 1024 kB 800 MHz 10× 1.35 V 62 W Socket 754 April 14, 2005 AMN3200BKX5BU
Mobile Athlon 64 3400+ 2200 MHz 1024 kB 800 MHz 11× 1.35 V 62 W Socket 754 April 14, 2005 AMN3400BKX5BU
Mobile Athlon 64 3700+ 2400 MHz 1024 kB 800 MHz 12× 1.35 V 62 W Socket 754 April 14, 2005 AMN3700BKX5BU
Mobile Athlon 64 4000+ 2600 MHz 1024 kB 800 MHz 13× 1.35 V 62 W Socket 754 August 16, 2005 AMN4000BKX5BU

Turion 64

"Lancaster" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion 64 ML-28 1600 MHz 512 kB 800 MHz 8x 1.35 V 35 W Socket 754 June 22, 2005 TMDML28BKX4LD
Turion 64 ML-30 1600 MHz 1024 kB 800 MHz 8x 1.35 V 35 W Socket 754 March 10, 2005 TMDML30BKX5LD
Turion 64 ML-32 1800 MHz 512 kB 800 MHz 9x 1.35 V 35 W Socket 754 March 10, 2005 TMDML32BKX4LD
Turion 64 ML-34 1800 MHz 1024 kB 800 MHz 9x 1.35 V 35 W Socket 754 March 10, 2005 TMDML34BKX5LD
Turion 64 ML-37 2000 MHz 1024 kB 800 MHz 10x 1.35 V 35 W Socket 754 March 10, 2005 TMDML37BKX5LD
Turion 64 ML-40 2200 MHz 1024 kB 800 MHz 11x 1.35 V 35 W Socket 754 June 22, 2005 TMDML40BKX5LD
Turion 64 ML-42 2400 MHz 512 kB 800 MHz 12x 1.35 V 35 W Socket 754 October 4, 2005 TMDML42BKX4LD
Turion 64 ML-44 2400 MHz 1024 kB 800 MHz 12x 1.35 V 35 W Socket 754 January 4, 2006 TMDML44BKX5LD
Turion 64 MT-28 1600 MHz 512 kB 800 MHz 8x 1.20 V 25 W Socket 754 June 22, 2005 TMSMT28BQX4LD
Turion 64 MT-30 1600 MHz 1024 kB 800 MHz 8x 1.20 V 25 W Socket 754 March 10, 2005 TMSMT30BQX5LD
Turion 64 MT-32 1800 MHz 512 kB 800 MHz 9x 1.20 V 25 W Socket 754 March 10, 2005 TMSMT32BQX4LD
Turion 64 MT-34 1800 MHz 1024 kB 800 MHz 9x 1.20 V 25 W Socket 754 March 10, 2005 TMSMT34BQX5LD
Turion 64 MT-37 2000 MHz 1024 kB 800 MHz 10x 1.20 V 25 W Socket 754 August 8, 2005 TMSMT37BQX5LD
Turion 64 MT-40 2200 MHz 1024 kB 800 MHz 11x 1.20 V 25 W Socket 754 August 8, 2005 TMSMT40BQX5LD

Kite platform (2006)

Introduced in 2006, the Kite platform consists of:

AMD mobile Kite platform
Mobile processor Processors – Socket S1
  • Mobile Sempron single-core 64-bit processor (codenamed Keene), or
  • Turion 64 single-core 64-bit processor (codenamed Richmond), or
  • Turion 64 X2 dual-core 64-bit processor (codenamed Taylor, Trinidad)
Mobile chipset
Mobile support

Mobile Sempron

"Keene" (Socket S1, F2, 90 nm, Low power)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Model Number Frequency L2 Cache HyperTransport Mult.2 Voltage TDP Release Date Part Number(s)
Mobile Sempron 3200+ 1600 MHz 512 kB 800 MHz 8x 0.950 – 1.125 V 25 W May 17, 2006 SMS3200HAX4CM
Mobile Sempron 3400+ 1800 MHz 256 kB 800 MHz 9x 0.950 – 1.125 V 25 W May 17, 2006 SMS3400HAX3CM
Mobile Sempron 3500+ 1800 MHz 512 kB 800 MHz 9x 0.950 – 1.125 V 25 W May 17, 2006 SMS3500HAX4CM
Mobile Sempron 3600+ 2000 MHz 256 kB 800 MHz 10x 0.950 – 1.125 V 25 W Oct 23, 2006 SMS3600HAX3CM

Turion 64

"Richmond" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion 64 MK-36 2000 MHz 512 kB 800 MHz 10x 1.15 V 31 W Socket S1 September 1, 2006 TMDMK36HAX4CM
Turion 64 MK-38 2200 MHz 512 kB 800 MHz 11x 1.15 V 31 W Socket S1 Q1 2007 TMDMK38HAX4CM

Turion 64 X2

"Taylor" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion 64 X2 TL-50 1600 MHz 2 × 256 kB 800 MHz 8x 0.8 – 1.10 V 31 W Socket S1 May 17, 2006 TMDTL50HAX4CT

"Trinidad" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion 64 X2 TL-52 1600 MHz 2 × 512 kB 800 MHz 8x 0.8 – 1.125 V 31 W Socket S1 May 17, 2006 TMDTL52HAX5CT
Turion 64 X2 TL-56 1800 MHz 2 × 512 kB 800 MHz 9x 0.8 – 1.125 V 33 W Socket S1 May 17, 2006 TMDTL56HAX5CT
Turion 64 X2 TL-60 2000 MHz 2 × 512 kB 800 MHz 10x 0.8 – 1.125 V 35 W Socket S1 May 17, 2006 TMDTL60HAX5CT
Turion 64 X2 TL-64 2200 MHz 2 × 512 kB 800 MHz 11x 0.8 – 1.125 V 35 W Socket S1 January 30, 2007 TMDTL64HAX5CT

Kite Refresh platform (2007)

AMD used Kite Refresh as the codenamed for the second-generation AMD mobile platform introduced in February 2007.

AMD mobile Kite Refresh platform
Mobile processor Processors – Socket S1
  • Turion 64 X2 dual-core 64-bit Hawk family processor 65 nm (codenamed Tyler), or
  • Mobile Sempron single-core 64-bit processor 65 nm (codenamed Sherman)
Mobile chipset
  • HDMI, HyperTransport 1.0 and PCI Express 1.0
  • DDR2-800 SO-DIMM
Mobile support

Mobile Sempron

"Sherman" (Socket S1, G1 & G2, 65 nm, Low power)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64

Model Number Frequency L2 Cache HyperTransport Mult.2 Voltage TDP Release Date Part Number(s)
Sempron 2100+ fanless[1] 1000 MHz 256 kB 800 MHz 5x 0.950 – 1.125 V 9 W May 30, 2007 SMF2100HAX3DQE (G1)
Mobile Sempron 3600+ 2000 MHz 256 kB 800 MHz 10x 25 W SMS3600HAX3DN (G2)
Mobile Sempron 3700+ 2000 MHz 512 kB 800 MHz 10x 25 W SMS3700HAX4DQE (G1)
Mobile Sempron 3800+ 2200 MHz 256 kB 800 MHz 11x 31 W SMD3800HAX3DN (G2)
Mobile Sempron 4000+ 2200 MHz 512 kB 800 MHz 11x 31 W SMD4000HAX4DN (G2)

Athlon 64 X2

"Tyler" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Athlon 64 X2 TK-42 1600 MHz 2 × 512 kB 800 MHz 8.0x 1.075/1.10/1.125 V 20 W Socket S1 AMETK42HAX5DM
Athlon 64 X2 TK-53 1700 MHz 2 × 256 kB 800 MHz 8.5x 1.075/1.10/1.125 V 31 W Socket S1 August 20, 2007 AMDTK53HAX4DC
Athlon 64 X2 TK-55 1800 MHz 2 × 256 kB 800 MHz 9.0x 1.075/1.10/1.125 V 31 W Socket S1 Aug 20 2007 AMDTK55HAX4DC
Athlon 64 X2 TK-57 1900 MHz 2 × 256 kB 800 MHz 9.5x 1.075/1.10/1.125 V 31 W Socket S1 2008 AMDTK57HAX4DM

Turion 64 X2

"Tyler" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion 64 X2 TL-56 1800 MHz 2 × 512 kB 800 MHz 9.0x 1.075/1.10/1.125 V 31 W Socket S1 May 7, 2007 TMDTL56HAX5DC
Turion 64 X2 TL-58 1900 MHz 2 × 512 kB 800 MHz 9.5x 1.075/1.10/1.125 V 31 W Socket S1 May 7, 2007 TMDTL58HAX5DC
Turion 64 X2 TL-60 2000 MHz 2 × 512 kB 800 MHz 10.0x 1.075/1.10/1.125 V 31 W Socket S1 May 7, 2007 TMDTL60HAX5DC
Turion 64 X2 TL-62 2100 MHz 2 × 512 kB 800 MHz 10.5x 1.075/1.10/1.125 V 35 W Socket S1 Jan 21 2008 TMDTL62HAX5DM
Turion 64 X2 TL-64 2200 MHz 2 × 512 kB 800 MHz 11.0x 1.075/1.10/1.125 V 35 W Socket S1 May 7, 2007 TMDTL64HAX5DC
Turion 64 X2 TL-66 2300 MHz 2 × 512 kB 800 MHz 11.5x 1.075/1.10/1.125 V 35 W Socket S1 May 7, 2007
Jul 10 2007		 TMDTL66HAX5DC
TMDTL66HAX5DM
Turion 64 X2 TL-68 2400 MHz 2 × 512 kB 800 MHz 12.0x 1.075/1.10/1.125 V 35 W Socket S1 December 19, 2007 TMDTL68HAX5DM

Puma platform (2008)

The Puma platform introduced in 2008 with June 2008 availability for the third-generation AMD mobile platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Dual-core 64-bit codenamed Griffin of processors, named "Turion X2 Ultra", or
  • Mobile Sempron single-core 64-bit processor (codenamed Sable), with the following:
    • Split-power planes and linked power management support
    • Support for possible low voltage processors
Mobile chipset AMD M780 series chipset
Mobile support
  • Wireless IEEE 802.11 a/b/g/n mini-PCIe Wi-Fi adapter
  • Hybrid hard drives
  • Desktop and mobile Architecture for System Hardware (DASH) 1.0 support (DASH page)
  • Trusted Platform Module (TPM) support

Mobile Sempron

"Sable" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Sempron SI-40 2000 MHz 512 kB 1800 MHz 10.0x 1.075 – 1.125 V 25 W Socket S1G2 June 4, 2008 SMSI40SAM12GG
Sempron SI-42 2100 MHz 512 kB 1800 MHz 10.5x 1.075 – 1.125 V 25 W Socket S1G2 Q3 2008 SMSI42SAM12GG

Athlon X2

"Lion" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Athlon X2 QL-60 1900 MHz 2 × 512 kB 1800 MHz 9.5x 0.95 – 1.1 V 35 W Socket S1G2 June 4, 2008 AMQL60DAM22GG
Athlon X2 QL-62 2000 MHz 2 × 512 kB 1800 MHz 10.0x 0.95 – 1.1 V 35 W Socket S1G2 Q3 2008 AMQL62DAM22GG
Athlon X2 QL-64 2100 MHz 2 × 512 kB 1800 MHz 10.5x 0.95 – 1.1 V 35 W Socket S1G2 Q4 2008 AMQL64DAM22GG
Athlon X2 QL-65 2100 MHz 2 × 512 kB 2000 MHz 10.5x 0.95 – 1.1 V 35 W Socket S1G2 Q4 2008 AMQL65DAM22GG
Athlon X2 QL-66 2200 MHz 2 × 512 kB 1800 MHz 11.0x 0.95 – 1.1 V 35 W Socket S1G2 Q4 2008 AMQL66DAM22GG
Athlon X2 QL-67 2200 MHz 2 × 512 kB 2000 MHz 11.0x 0.95 – 1.1 V 35 W Socket S1G2 Q4 2008 AMQL67DAM22GG

Turion X2

"Lion" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion X2 RM-70[2] 2000 MHz 2 × 512 kB 1800 MHz 10x 0.75 – 1.2 V 31 W Socket S1G2 June 4, 2008 TMRM70DAM22GG
Turion X2 RM-72[2] 2100 MHz 2 × 512 kB 1800 MHz 10.5x 0.75 – 1.2 V 35 W Socket S1G2 Q3 2008 TMRM72DAM22GG
Turion X2 RM-74[2] 2200 MHz 2 × 512 kB 1800 MHz 11.0x 0.75 – 1.2 V 35 W Socket S1G2 Q4 2008 TMRM74DAM22GG
Turion X2 RM-75[2] 2200 MHz 2 × 512 kB 2000 MHz 11.0x 0.75 – 1.2 V 35 W Socket S1G2 Q4 2008 TMRM75DAM22GG
Turion X2 RM-76[2] 2300 MHz 2 × 512 kB 1800 MHz 11.5x 0.75 – 1.2 V 35 W Socket S1G2 Q4 2008 TMRM76DAM22GG
Turion X2 RM-77[2] 2300 MHz 2 × 512 kB 2000 MHz 11.5x 0.75 – 1.2 V 35 W Socket S1G2 Q4 2008 TMRM77DAM22GG

Turion X2 Ultra

"Lion" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion X2 Ultra ZM-80[2] 2100 MHz 2 × 1 MB 1800 MHz 10.5x 0.75 – 1.2 V 32 W Socket S1G2 June 4, 2008 TMZM80DAM23GG
Turion X2 Ultra ZM-82[2] 2200 MHz 2 × 1 MB 1800 MHz 11.0x 0.75 – 1.2 V 35 W Socket S1G2 June 4, 2008 TMZM82DAM23GG
Turion X2 Ultra ZM-84[2] 2300 MHz 2 × 1 MB 1800 MHz 11.5x 0.75 – 1.2 V 35 W Socket S1G2 Q3 2008 TMZM84DAM23GG
Turion X2 Ultra ZM-85[2] 2300 MHz 2 × 1 MB 2200 MHz 11.5x 0.75 – 1.2 V 35 W Socket S1G2 Q3 2008 TMZM85DAM23GG
Turion X2 Ultra ZM-86[2] 2400 MHz 2 × 1 MB 1800 MHz 12.0x 0.75 – 1.2 V 35 W Socket S1G2 June 4, 2008 TMZM86DAM23GG
Turion X2 Ultra ZM-87[2] 2400 MHz 2 × 1 MB 2200 MHz 12.0x 0.75 – 1.2 V 35 W Socket S1G2 Q3 2008 TMZM87DAM23GG
Turion X2 Ultra ZM-88[2] 2500 MHz 2 × 1 MB 1800 MHz 12.5x 0.75 – 1.2 V 35 W Socket S1G2 Q3 2008 TMZM88DAM23GG

Yukon platform (2009)

The Yukon platform was introduced on January 8, 2009, with expected April availability for the first AMD Ultrathin Platform targeting the ultra-portable notebook market.

AMD mobile Initial platform
Mobile processor Processors
  • Single-core 64-bit codenamed Huron of processors, named "Athlon Neo", or
  • Mobile Sempron single-core 64-bit processor (codenamed Huron), with the following:
    • 27 mm (W) × 27 mm (D) × 2.5 mm (H) BGA package, named "ASB1"
    • low voltage processors
Mobile chipset AMD RS690E series chipset + SB600 southbridge
Mobile support
  • Wireless connectivity with 3G (as option)
  • Wireless IEEE 802.11 a/b/g/n mini-PCIe Wi-Fi adapter

Sempron

"Huron" (65 nm, Low power)

  • Both models support: MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64
  • Sempron 210U supports extra AMD-V
Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Package/Socket Release date Order Part Number
Sempron 200U[3] 1000 MHz 256 kB 1600 MHz 5x 0.925 V 8 W Socket ASB1 January 8, 2009 SMF200UOAX3DV
Sempron 210U 1500 MHz 256 kB 1600 MHz 7.5x 0.925 V 15 W Socket ASB1 January 8, 2009 SMG210UOAX3DX

Athlon Neo

"Huron" (65 nm, 15 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!, AMD-V[4]

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Package Release Date Part Number(s)
Athlon Neo MV-40 1600 MHz 512 kB 800 MHz 8x 1.1 V 15 W Socket ASB1 January 8, 2009 AMGMV40OAX4DX

"Sherman" (65 nm, 15 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Package Release Date Part Number(s)
Athlon Neo TF-20 1600 MHz 512 kB 800 MHz 8x 1.0 V 15 W Socket S1 January 8, 2009 AMGTF20HAX4DN

"Congo" (65 nm, 13 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Package Release Date Part Number(s)
Athlon Mobile X2 L310 1200 MHz 2 × 512 kB 800 MHz 6x 0.925 V 13 W Socket S1 January 8, 2009 AMML310HAX5DM

Turion

"Congo" (65 nm, 20 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Model Number Frequency L2 Cache HT Mult.1 VCore TDP Package Release Date Part Number(s)
Turion Mobile X2 L510 1600 MHz 2 × 512 kB 800 MHz 8x 0.925 V 20 W Socket S1 January 8, 2009 TMEL510HAX5DM

Congo platform (2009)

The Congo platform [5] was introduced in September 2009, as the second AMD Ultrathin Platform targeting the ultra-portable notebook market.

AMD mobile Initial platform
Mobile processor Processors
  • Single or Dual-core 64-bit processors codenamed Conesus, with the following:
    • made on 65 nm process
    • 15 W (single-core) or 18 W (dual-core) TDP
    • 27 mm (W) × 27 mm (D) × 2.5 mm (H) BGA package, named "ASB1"
    • low voltage processors
    • DDR2 SO-DIMM
Mobile chipset AMD M780G(RS780M) series chipset + SB710 southbridge

Athlon Neo X2

"Conesus" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Athlon Neo X2 L325 1500 MHz 2 × 512 kB 800 MHz 7.5x 0.925 V 18 W Socket ASB1 August 10, 2009 AMZL325OAX5DY
Athlon Neo X2 L335 1600 MHz 2 × 512 kB 800 MHz 8.0x 0.925 V 18 W Socket ASB1 February 2010 AMZL335OAX5DY

Turion Neo X2

"Conesus" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V, PowerNow!

Model Number Frequency L2 Cache HT Mult.1 Voltage TDP Socket Release date Order Part Number
Turion Neo X2 L625 1600 MHz 2 × 512 kB 800 MHz 8x 0.925 V 18 W Socket ASB1 August 10, 2009 TMZL625OAX5DY

Tigris platform (2009)

The Tigris platform [6] introduced in September 2009 for the AMD Mainstream Notebook Platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Single or Dual-core 64-bit processors codenamed Caspian, with the following:
    • made on 45 nm process
    • 25 W (single-core) or 35 W (dual-core) TDP
Mobile chipset AMD M785(RS880M) series chipset + SB710 southbridge

Sempron

"Caspian" (45 nm)

Single-core mobile processor

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model Number Frequency L2 Cache FPU width[6] HT Mult. Voltage TDP Socket Release date Order Part Number
Sempron M100 2000 MHz 512 kB 64-bit 1600 MHz 10.0x 25 W Socket S1G3 September 10, 2009 SMM100SBO12GQ
Sempron M120 2100 MHz 512 kB 64-bit 1600 MHz 10.5x 25 W Socket S1G3 September 10, 2009 SMM120SBO12GQ
Sempron M140 2200 MHz 512 kB 64-bit 1600 MHz 10.5x 25 W Socket S1G3 April 2010 SMM140SBO12GQ


Athlon II

"Caspian" (45 nm)

Dual-core mobile processor

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model number Frequency L2 cache FPU width[6] HT Mult. TDP Socket Release date Part number
Athlon II M300 2.0 GHz 2 × 512 kB 64-bit 1.6 GHz 10× 35 W Socket S1G3 September 10, 2009 AMM300DBO22GQ
Athlon II M320 2.1 GHz 2 × 512 kB 64-bit 1.6 GHz 10.5× 35 W Socket S1G3 September 10, 2009 AMM320DBO22GQ
Athlon II M340 2.2 GHz 2 × 512 kB 64-bit 1.6 GHz 11× 35 W Socket S1G3 September 10, 2009 AMM340DBO22GQ
Athlon II M360 2.3 GHz 2 × 512 kB 64-bit 1.6 GHz 11× 35 W Socket S1G3 May 2010 AMM360DBO22GQ


Turion II

"Caspian" (45 nm)

Dual-core mobile processor

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model number Clock
speed		 L2 cache FPU width[6] Hyper
Transport		 Multi TDP Socket Release date Part number
Turion II M500 2.2 GHz 2 × 512 KB 128-bit 1.8 GHz 11× 35 W Socket S1G3 September 10, 2009 TMM500DBO22GQ
Turion II M520 2.3 GHz 2 × 512 KB 128-bit 1.8 GHz 11.5× 35 W Socket S1G3 September 10, 2009 TMM520DBO22GQ
Turion II M540 2.4 GHz 2 × 512 KB 128-bit 1.8 GHz 12× 35 W Socket S1G3 September 10, 2009 TMM540DBO22GQ
Turion II M560 2.5 GHz 2 × 512 KB 128-bit 1.8 GHz 12× 35 W Socket S1G3 April 2010 TMM560DBO22GQ


Turion II (Ultra)

"Caspian" (45 nm)

Dual-core mobile processor

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Model number Clock
speed		 L2 cache FPU width[6] Hyper
Transport		 Multi TDP Socket Release date Part number
Turion II Ultra M600 2.4 GHz 2 × 1 MB 128-bit 1.8 GHz 12× 35 W Socket S1G3 September 10, 2009 TMM600DBO23GQ
Turion II Ultra M620 2.5 GHz 2 × 1 MB 128-bit 1.8 GHz 12.5× 35 W Socket S1G3 September 10, 2009 TMM620DBO23GQ
Turion II Ultra M640 2.6 GHz 2 × 1 MB 128-bit 1.8 GHz 13× 35 W Socket S1G3 September 10, 2009 TMM640DBO23GQ
Turion II Ultra M660 2.7 GHz 2 × 1 MB 128-bit 1.8 GHz 13.5× 35 W Socket S1G3 September 10, 2009 TMM660DBO23GQ


Nile platform (2010)

The Nile platform [7][8] introduced on May 12, 2010, for the third AMD Ultrathin Platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Single or Dual-core 64-bit processors codenamed Geneva, with the following:
    • made on 45 nm process
    • support for DDR3 memory[9]
    • 9 W, 12 W or 15 W TDP
Mobile chipset AMD RS880 series chipset + SB850 southbridge
  • MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
  • Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1066)

V series

"Geneva" (45 nm)

Single-core mobile processor

Model
number		 Clock
speed		 L2 cache FPU width[8] Hyper
Transport		 Multi TDP Socket Release date Part number
V105 1.2 GHz 512 KB 64-bit 1.0 GHz 6× 9 W ASB2 May 12, 2010 VMV105FDV12GM


Athlon II Neo

"Geneva" (45 nm)

Single-core mobile processor Single-core mobile processor

Model number Frequency L2 Cache FPU width[10] HT Mult. TDP Socket Release date Order Part Number
Athlon II Neo K125 1.7 GHz 1 MB 64-bit 1.0 GHz 8.5× 12 W ASB2 May 12, 2010 AMK125LAV13GM
Athlon II Neo K145 1.8 GHz 1 MB 64-bit 1.0 GHz 9× 12 W ASB2 January 4, 2011 AMK145LAV13GM

Dual-core mobile processor

Model number Frequency L2 Cache FPU width[10] HT Mult. TDP Socket Release date Order Part Number
Athlon II Neo N36L 1.3 GHz 2 × 1 MB 64-bit 1.0 GHz 6.5× 12 W ASB2 April 26, 2010 AEN36LLAV23GME
Athlon II Neo K325 1.3 GHz 2 × 1 MB 64-bit 1.0 GHz 6.5× 12 W ASB2 May 12, 2010 AMK325LAV23GM
Athlon II Neo K345 1.4 GHz 2 × 1 MB 64-bit 1.0 GHz 7× 12 W ASB2 January 4, 2011 AMK345LAV23GM


Turion II Neo

"Geneva" (45 nm)

Dual-core mobile processor

Model number Clock
speed		 L2 cache FPU width[10] Hyper
Transport		 Multi TDP Socket Release date Part number
Turion II Neo N40L 1.5 GHz 2 × 1 MB 128-bit 1.6 GHz 7.5× 15 W Socket ASB2 April 26, 2010 TEN40LGAV23GME
Turion II K625 1.5 GHz 2 × 1 MB 128-bit 1.6 GHz 7.5× 15 W Socket ASB2 May 12, 2010 TMK625GAV23GM
Turion II K645 1.6 GHz 2 × 1 MB 128-bit 1.6 GHz 8× 15 W Socket ASB2 January 4, 2011 TMK645GAV23GM
Turion II K665 1.7 GHz 2 × 1 MB 128-bit 1.6 GHz 8.5× 15 W Socket ASB2 May 12, 2010 TMK665GAV23GM
Turion II K685 1.8 GHz 2 × 1 MB 128-bit 1.6 GHz 9× 15 W Socket ASB2 January 4, 2011 TMK685GAV23GM
Turion II Neo N54L 2.2 GHz 2 × 1 MB 128-bit 1.6 GHz 11× 25 W Socket ASB2 May 2010 TEN54LSDV23GME


Danube platform (2010)

The Danube platform[7][10] introduced on May 12, 2010, for the AMD Mainstream Notebook Platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Single, Dual, Triple or Quad-core 64-bit processors codenamed Champlain, with the following:
    • made on 45 nm process
    • support for DDR3 memory[9]
    • 25, 35 or 45 W TDP
Mobile chipset AMD RS880 series chipset + SB850 southbridge
  • MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
  • Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1066 MHz)

V series

Champlain (45 nm)

Single-core mobile processor

Model
number		 Clock
speed		 L2 cache FPU width[10] Hyper
Transport		 Multi TDP Socket Release date Part number
V120 2.2 GHz 512 KB 64-bit 1.6 GHz 11× 25 W S1G4 May 12, 2010 VMV120SGR12GM
V140 2.3 GHz 512 KB 64-bit 1.6 GHz 11.5× 25 W S1G4 October 4, 2010 VMV140SGR12GM
V160 2.4 GHz 512 KB 64-bit 1.6 GHz 12× 25 W S1G4 January 4, 2011 VMV160SGR12GM


Athlon II

Champlain (45 nm)

Dual-core mobile processor

Model Number Frequency L2 cache FPU width[10] HT Mult. TDP Socket Release date Order Part Number
Athlon II P320 2.1 GHz 2 × 512 KB 64-bit 1.6 GHz 10.5× 25 W Socket S1G4 May 12, 2010 AMP320SGR22GM
Athlon II P340 2.2 GHz 2 × 512 KB 64-bit 1.6 GHz 11× 25 W Socket S1G4 October 4, 2010 AMP340SGR22GM
Athlon II P360 2.3 GHz 2 × 512 KB 64-bit 1.6 GHz 11.5× 25 W Socket S1G4 January 4, 2011 AMP360SGR22GM
Athlon II N330 2.3 GHz 2 × 512 KB 64-bit 1.6 GHz 11.5× 35 W Socket S1G4 May 12, 2010 AMN330DCR22GM
Athlon II N350 2.4 GHz 2 × 512 KB 64-bit 1.6 GHz 12× 35 W Socket S1G4 October 4, 2010 AMN350DCR22GM
Athlon II N370 2.5 GHz 2 × 512 KB 64-bit 1.6 GHz 12.5× 35 W Socket S1G4 January 4, 2011 AMN370DCR22GM


Turion II

Champlain (45 nm)

Dual-core mobile processor

Model number Clock
speed		 L2 cache FPU width[10] Hyper
Transport		 Multi TDP Socket Release date Part number
Turion II P520 2.3 GHz 2 × 1 MB 128-bit 1.8 GHz 11.5× 25 W Socket S1G4 May 12, 2010 TMP520SGR23GM
Turion II P540 2.4 GHz 2 × 1 MB 128-bit 1.8 GHz 12× 25 W Socket S1G4 October 4, 2010 TMP540SGR23GM
Turion II P560 2.5 GHz 2 × 1 MB 128-bit 1.8 GHz 12.5× 25 W Socket S1G4 October 19, 2010 TMP560SGR23GM
Turion II N530 2.5 GHz 2 × 1 MB 128-bit 1.8 GHz 12.5× 35 W Socket S1G4 May 12, 2010 TMN530DCR23GM
Turion II N550 2.6 GHz 2 × 1 MB 128-bit 1.8 GHz 13× 35 W Socket S1G4 October 4, 2010 TMN550DCR23GM
Turion II N570 2.7 GHz 2 × 1 MB 128-bit 1.8 GHz 13.5× 35 W Socket S1G4 January 4, 2011 TMN570DCR23GM


Phenom II

  • MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
  • Unlike desktop models, mobile Phenom II-based models do not have L3 cache
  • Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1333 MHz)

Champlain (45 nm)

Dual-core mobile processor

Model number Clock
speed		 L2 cache FPU width[10] Hyper
Transport		 Multi TDP Socket Release date Part number
Phenom II P650 2.6 GHz 2 × 1 MB 128-bit 1.8 GHz 13× 25 W Socket S1G4 October 19, 2010 HMP650SGR23GM
Phenom II N620 2.8 GHz 2 × 1 MB 128-bit 1.8 GHz 14× 35 W Socket S1G4 May 12, 2010 HMN620DCR23GM
Phenom II N640 2.9 GHz 2 × 1 MB 128-bit 1.8 GHz 14.5× 35 W Socket S1G4 October 4, 2010 HMN640DCR23GM
Phenom II N660 3.0 GHz 2 × 1 MB 128-bit 1.8 GHz 15× 35 W Socket S1G4 January 4, 2011 HMN660DCR23GM
Phenom II X620 BE 3.1 GHz 2 × 1 MB 128-bit 1.8 GHz 15.5× 45 W Socket S1G4 May 12, 2010 HMX620HIR23GM
Phenom II X640 BE 3.2 GHz 2 × 1 MB 128-bit 1.8 GHz 16× 45 W Socket S1G4 May 10, 2011 HMX640HIR23GM


Triple-core mobile processors

Model number Clock
speed		 L2 cache FPU width[10] Hyper
Transport		 Multi TDP Socket Release date Part number
Phenom II P820 1.8 GHz 3 × 512 KB 128-bit 1.8 GHz 9× 25 W Socket S1G4 May 12, 2010 HMP820SGR32GM
Phenom II P840 1.9 GHz 3 × 512 KB 128-bit 1.8 GHz 9.5× 25 W Socket S1G4 October 4, 2010 HMP840SGR32GM
Phenom II P860 2.0 GHz 3 × 512 KB 128-bit 1.8 GHz 10× 25 W Socket S1G4 October 4, 2010 HMP860SGR32GM
Phenom II N830 2.1 GHz 3 × 512 KB 128-bit 1.8 GHz 10.5× 35 W Socket S1G4 May 12, 2010 HMN830DCR32GM
Phenom II N850 2.2 GHz 3 × 512 KB 128-bit 1.8 GHz 11× 35 W Socket S1G4 October 4, 2010 HMN850DCR32GM
Phenom II N870 2.3 GHz 3 × 512 KB 128-bit 1.8 GHz 11.5× 35 W Socket S1G4 January 4, 2011 HMN870DCR32GM


Quad-core mobile processors

Model number Clock
speed		 L2 cache FPU width[10] Hyper
Transport		 Multi TDP Socket Release date Part number
Phenom II P920 1.6 GHz 4 × 512 KB 128-bit 1.8 GHz 8× 25 W Socket S1G4 May 12, 2010 HMP920SGR42GM
Phenom II P940 1.7 GHz 4 × 512 KB 128-bit 1.8 GHz 8.5× 25 W Socket S1G4 October 4, 2010 HMP940SGR42GM
Phenom II P960 1.8 GHz 4 × 512 KB 128-bit 1.8 GHz 9× 25 W Socket S1G4 October 19, 2010 HMP960SGR42GM
Phenom II N930 2.0 GHz 4 × 512 KB 128-bit 1.8 GHz 10× 35 W Socket S1G4 May 12, 2010 HMN930DCR42GM
Phenom II N950 2.1 GHz 4 × 512 KB 128-bit 1.8 GHz 10.5× 35 W Socket S1G4 October 4, 2010 HMN950DCR42GM
Phenom II N970 2.2 GHz 4 × 512 KB 128-bit 1.8 GHz 11× 35 W Socket S1G4 January 4, 2011 HMN970DCR42GM
Phenom II X920 BE 2.3 GHz 4 × 512 KB 128-bit 1.8 GHz 11.5× 45 W Socket S1G4 May 12, 2010 HMX920HIR42GM
Phenom II X940 BE 2.4 GHz 4 × 512 KB 128-bit 1.8 GHz 12× 45 W Socket S1G4 January 4, 2011 HMX940HIR42GM


Brazos platform (2011)

AMD Ultrathin Platform introduced on January 5, 2011, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It features the 40 nm AMD Ontario (a 9-watt AMD APU for netbooks and small form factor desktops and devices) and Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. Both low-power APU versions feature two Bobcat x86 cores and fully support DirectX11, DirectCompute (Microsoft programming interface for GPU computing) and OpenCL (cross-platform programming interface standard for multi-core x86 and accelerated GPU computing). Both also include UVD dedicated hardware acceleration for HD video including 1080p resolutions.[11][12][13][14] This platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Single or Dual-core 64-bit AMD APU codenamed Ontario, Zacate and with the following:
    • Bobcat cores made on 40 nm CMOS process
    • support for DDR3 1066 or 1333 MHz (E-450) memory
    • 9 W or 18 W TDP
  • Radeon HD 6xxx GPU on 40 nm process
    • Cedar graphics core with 80 SP
    • DirectX 11
    • UVD 3
Mobile chipset

"Ontario" (40 nm)

Model Number Step. CPU GPU Memory
Support		 TDP Released Part Number Info
Cores Freq. Turbo L2 Cache Mult. Voltage Model Config Freq.
C-30 B0 1 1.2 GHz — 512 kB 12× 1.25 – 1.35 HD 6250 80:8:4 276 MHz DDR3-1066 9 W January 4, 2011 CMC30AFPB12GT C-30
C-50 2 1.0 GHz 2 × 512 kB 10× 1.05 – 1.35 277 MHz CMC50AFPB22GT C-50
C-60 C0 1.33 GHz HD 6290 276 – 400 MHz August 22, 2011 CMC60AFPB22GV C-60

"Zacate" (40 nm)

  • SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, PowerNow!, AMD-V
  • Memory support: DDR3 SDRAM, DDR3L SDRAM (Single-channel, up to 1066 MHz)
  • 2.5 GT/s UMI.
  • Config GPU are Unified shaders : Texture mapping units : Render output units
  • Socket FT1 (BGA-413)
Model Number Step. CPU GPU Memory
Support		 TDP Released Part Number Info
Cores Freq. Turbo L2 Cache Mult. Voltage Model Config Freq.
E-240 B0 1 1.5 GHz — 512 kB 15× 1.175 – 1.35 HD 6310 80:8:4 500 MHz DDR3-1066 18 W January 4, 2011 EME240GBB12GT E-240
E-300 B0 2 1.3 GHz 2 × 512 kB 13× 488 MHz August 22, 2011 EME300GBB22GV E-300
E-350 B0 1.6 GHz 16× 1.25 – 1.35 492 MHz January 4, 2011 EME350GBB22GT E-350
E-450 B0 1.65 GHz 16.5× HD 6320 508 – 600 MHz DDR3-1333 August 22, 2011 EME450GBB22GV E-450

Sabine (Fusion) platform (2011)

The Sabine platform[15] introduced on June 30, 2011, for the AMD Mainstream Notebook Platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Dual or Quad-core 64-bit AMD APU codenamed Llano, and with the following:
    • made on 32 nm process
    • support for DDR3 1600 MHz memory
    • 35 W or 45 W TDP
  • Radeon HD 6xxxG GPU on 32 nm process
    • Sumo graphics core with up to 400 SP
    • DirectX 11
    • UVD 3
Mobile chipset

"Llano" (32 nm)

  • SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V, Turbo Core
  • Memory support: 1.35 V DDR3L-1333 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel)
  • 2.5 GT/s UMI.
  • Transistors: 1.148 billion
  • Die size: 228 mm²
Model Number Step. CPU GPU Memory
Support		 TDP Socket Release Date Part Number(s)
Cores Freq. Turbo L2 Cache Mult. Vcore Model Config1 Freq.
E2-3000M B0 2 1.8 GHz 2.4 GHz 2 × 512 kB 18x 0.9125 – 1.4125 HD 6380G 160:8:4 400 MHz DDR3-1333 35 W FS1 June 14, 2011 EM3000DDX22GX
A4-3300M B0 2 1.9 GHz 2.5 GHz 2 × 1 MB 19x 0.9125 – 1.4125 HD 6480G 240:12:4 444 MHz DDR3-1333 35 W FS1 June 14, 2011 AM3300DDX23GX
A4-3305M B0 2 1.9 GHz 2.5 GHz 2 × 512 kB 19x 0.8750 – 1.4125 HD 6480G 160:8:4 593 MHz DDR3-1333 35 W FS1 December 7, 2011 AM3305DDX22GX
A4-3310MX B0 2 2.1 GHz 2.5 GHz 2 × 1 MB 21x 0.9125 – 1.4125 HD 6480G 240:12:4 444 MHz DDR3-1333 35 W FS1 June 14, 2011 AM3310HLX23GX
A4-3320M B0 2 2.0 GHz 2.6 GHz 2 × 1 MB 20x 0.9125 – 1.4125 HD 6480G 240:12:4 444 MHz DDR3-1333 35 W FS1 December 7, 2011 AM3320DDX23GX
A4-3330MX B0 2 2.2 GHz 2.6 GHz 2 × 1 MB 22x 0.9125 – 1.4125 HD 6480G 240:12:4 444 MHz DDR3-1600 45 W FS1 December 7, 2011 AM3330HLX23GX
A6-3400M B0 4 1.4 GHz 2.3 GHz 4 × 1 MB 14x 0.9125 – 1.4125 HD 6520G 320:16:8 400 MHz DDR3-1333 35 W FS1 June 14, 2011 AM3400DDX43GX
A6-3410MX B0 4 1.6 GHz 2.3 GHz 4 × 1 MB 16x 0.9125 – 1.4125 HD 6520G 320:16:8 400 MHz DDR3-1600 45 W FS1 June 14, 2011 AM3410HLX43GX
A6-3420M B0 4 1.5 GHz 2.4 GHz 4 × 1 MB 15x 0.9125 – 1.4125 HD 6520G 320:16:8 400 MHz DDR3-1333 35 W FS1 December 7, 2011 AM3420DDX43GX
A6-3430MX B0 4 1.7 GHz 2.4 GHz 4 × 1 MB 17x 0.9125 – 1.4125 HD 6520G 320:16:8 400 MHz DDR3-1600 45 W FS1 December 7, 2011 AM3430HLX43GX
A8-3500M B0 4 1.5 GHz 2.4 GHz 4 × 1 MB 15x 0.9125 – 1.4125 HD 6620G 400:20:8 444 MHz DDR3-1333 35 W FS1 June 14, 2011 AM3500DDX43GX
A8-3510MX B0 4 1.8 GHz 2.5 GHz 4 × 1 MB 18x 0.9125 – 1.4125 HD 6620G 400:20:8 444 MHz DDR3-1600 45 W FS1 June 14, 2011 AM3510HLX43GX
A8-3520M B0 4 1.6 GHz 2.5 GHz 4 × 1 MB 16x 0.9125 – 1.4125 HD 6620G 400:20:8 444 MHz DDR3-1333 35 W FS1 December 7, 2011 AM3520DDX43GX
A8-3530MX B0 4 1.9 GHz 2.6 GHz 4 × 1 MB 19x 0.9125 – 1.4125 HD 6620G 400:20:8 444 MHz DDR3-1600 45 W FS1 June 14, 2011 AM3530HLX43GX
A8-3550MX B0 4 2.0 GHz 2.7 GHz 4 × 1 MB 20x 0.9125 – 1.4125 HD 6620G 400:20:8 444 MHz DDR3-1600 45 W FS1 December 7, 2011 AM3550HLX43GX

1 Unified shaders : Texture mapping units : Render output units

Brazos 2.0 platform (2012)

AMD Ultrathin Platform introduced on June 6, 2012, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It will feature the 40 nm Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. This platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Dual-core 64-bit AMD APU codenamed Zacate and with the following:
    • Bobcat cores made on 40 nm CMOS process
    • support for DDR3 1333 MHz memory
    • 18 W TDP
  • Radeon HD 7xxx GPU on 40 nm process
    • Cedar graphics core with 80 SP
    • DirectX 11
    • UVD 3
Mobile chipset

"Ontario", "Zacate" (40 nm)

  • SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, PowerNow!, AMD-V
  • Single-channel DDR3 SDRAM, DDR3L SDRAM
  • 2.5 GT/s UMI.
  • Config GPU are Unified shaders : Texture mapping units : Render output units
  • Socket FT1 (BGA-413)
Model Number Step. CPU GPU Memory
Support		 TDP Release Date Part Number
Cores Freq. Turbo L2 Cache Mult. Vcore Model Config Freq. Turbo
C-70 C0 2 1.0 GHz 1.33 GHz 2 × 512 kB 10× HD 7290 80:8:4 276 MHz 400 MHz DDR3-1066 9 W September 27, 2012 CMC70AFPB22GV
E1-1200 B0 1.4 GHz — 14× HD 7310 500 MHz — 18 W June 6, 2012 EM1200GBB22GV
E2-1500 1.48 GHz 529 MHz — January 7, 2013
E2-1800 1.7 GHz 17× HD 7340 523 MHz 680 MHz DDR3-1333 June 6, 2012 EM1800GBB22GV
E2-2000 1.75 GHz 538 MHz 700 MHz January 7, 2013

Comal (Fusion) platform (2012)

The Comal platform introduced on May 15, 2012, for the AMD Mainstream Notebook Platform consists of:

AMD mobile Initial platform
Mobile processor Processors
  • Dual or Quad-core 64-bit AMD APU codenamed Trinity, and with the following:
    • Piledriver cores made on 32 nm process
    • support for DDR3 1600 MHz memory
    • 17 W, 25 W or 35 W TDP
  • Radeon HD 7xxxG GPU on 32 nm process
    • Devastator graphics core with up to 384 SP
    • DirectX 11
    • UVD 3.2
Mobile chipset

"Trinity" (2012, 32 nm)

Model Number Step. CPU GPU Memory
Support		 TDP Socket Release Date Part Number(s)
Cores Freq. Turbo L2 Cache Mult. Vcore Model Config1 Freq. Turbo
standard power
A4-4300M B0 2 2.5 GHz 3.0 GHz 1 MB 25× 0.8125 – 1.3 HD 7420G 128:8:4 480 MHz 655 MHz DDR3-1600 35 W FS1r2 May 2012 AM4300DEC23HJ
A6-4400M B0 2 2.7 GHz 3.2 GHz 1 MB 27× 0.8125 – 1.3 HD 7520G 192:12:4 496 MHz 685 MHz DDR3-1600 35 W FS1r2 May 15, 2012 AM4400DEC23HJ
A8-4500M B0 4 1.9 GHz 2.8 GHz 2 × 2 MB 19× 0.8125 – 1.3 HD 7640G 256:16:8 496 MHz 685 MHz DDR3-1600 35 W FS1r2 May 15, 2012 AM4500DEC44HJ
A10-4600M B0 4 2.3 GHz 3.2 GHz 2 × 2 MB 23× 0.8125 – 1.3 HD 7660G 384:24:8 496 MHz 685 MHz DDR3-1600 35 W FS1r2 May 15, 2012 AM4600DEC44HJ
low power
A4-4355M B0 2 1.9 GHz 2.4 GHz 1 MB 21× HD 7400G 192:12:4 327 MHz 424 MHz DDR3-1333 17 W FP2 September 27, 2012 AM4355SHE23HJ
A6-4455M B0 2 2.1 GHz 2.6 GHz 2 MB 21× 0.775 – 1.15 HD 7500G 256:16:8 327 MHz 424 MHz DDR3-1333 17 W FP2 May 15, 2012 AM4455SHE24HJ
A8-4555M B0 4 1.6 GHz 2.4 GHz 2 × 2 MB 16× HD 7600G 384:24:8 320 MHz 424 MHz DDR3-1333 19 W FP2 September 27, 2012 AM4555SHE44HJ
A10-4655M B0 4 2.0 GHz 2.8 GHz 2 × 2 MB 20× 0.85 – 1.2 HD 7620G 384:24:8 360 MHz 496 MHz DDR3-1333 25 W FP2 May 15, 2012 AM4655SIE44HJ

1 Config GPU are Unified shaders : Texture mapping units : Render output units

"Richland" (2013, 32 nm)

  • Elite Performance APU.[16][17]
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, NX bit, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, CVT16, F16C, Turbo Core
  • Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel)
  • 2.5 GT/s UMI.
  • Transistors: 1.303 billion
  • Die size: 246 mm²
Model Number Step. CPU GPU Memory
Support		 TDP Socket Release Date Part Number(s)
Cores Freq. Turbo L2 Cache Mult. Vcore Model Config Freq. Turbo
standard power
A4-5150M 2 2.7 GHz 3.3 GHz 1 MB HD 8350G 128:8:4 533 MHz 720 MHz DDR3-1600 35 W FS1r2 Q1 2013 AM5150DEC23HL
A6-5350M 2.9 GHz 3.5 GHz HD 8450G 192:12:4 533 MHz 720 MHz DDR3-1600 FS1r2 Q1 2013 AM5350DEC23HL
A6-5357M 2.9 GHz 3.5 GHz HD 8450G 192 533 MHz 720 MHz DDR3L-1600 FP2 (BGA) May 2013 AM5357DFE23HL
A8-5550M 4 2.1 GHz 3.1 GHz 2 × 2 MB HD 8550G 256:16:8 515 MHz 720 MHz DDR3-1600 FS1r2 Q1 2013 AM5550DEC44HL
A8-5557M 2.1 GHz 3.1 GHz HD 8550G 256 554 MHz 720 MHz DDR3L-1600 FP2 (BGA) May 2013 AM5557DFE44HL
A10-5750M 2.5 GHz 3.5 GHz HD 8650G 384:24:8 533 MHz 720 MHz DDR3-1866 FS1r2 Q1 2013 AM5750DEC44HL
A10-5757M 2.5 GHz 3.5 GHz HD 8650G 384 600 MHz 720 MHz DDR3L-1600 FP2 (BGA) May 2013 AM5757DFE44HL
low power
A4-5145M 2 2.0 GHz 2.6 GHz 1 MB HD 8310G 128 424 MHz 554 MHz DDR3L-1333 17 W FP2 (BGA) May 2013 AM5145SIE44HL?
A6-5345M 2.2 GHz 2.8 GHz HD 8410G 192 450 MHz 600 MHz DDR3L-1333 May 2013 AM5345SIE44HL?
A8-5545M 4 1.7 GHz 2.7 GHz 2 × 2 MB HD 8510G 384 450 MHz 554 MHz DDR3L-1333 19 W May 2013 AM5545SIE44HL
A10-5745M 2.1 GHz 2.9 GHz HD 8610G 384 533 MHz 626 MHz DDR3L-1333 25 W May 2013 AM5745SIE44HL

1 Config GPU are Unified shaders : Texture mapping units : Render output units

Jaguar (2013)

AMD mobile Initial platform
Mobile processor Processors
  • Dual-core or quad-core 64-bit AMD APU codenamed Kabini, Temash and with the following:
    • Jaguar cores made on 28 nm CMOS process
    • support for Single-channel DDR3 SDRAM and DDR3L SDRAM 1600 MHz memory
    • 3.9 – 25 W TDP
  • Radeon HD 8xxx GPU on 28 nm process
  • Integrated FCH
  • SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, CLMUL, AES, F16C, ABM, BMI1, NX bit, AMD64, PowerNow!, AMD-V
  • Socket FT3 (BGA)
  • Turbo Dock Technology, C6 and CC6 low power states

"Temash" (2013, 28 nm)

Elite Mobility APU:

Model Step. CPU GPU Memory TDP Released Part Number
Cores Freq. Turbo L2 Cache Mult.1 Vcore Model Config1 Freq. Turbo
A4-1200 B0[citation needed] 2 1.0 GHz — 1 MB HD 8180 128:8:4 225 MHz — DDR3L-1066 3.9 W May 2013 AT1200IFJ23HM
A4-1250 HD 8210 300 MHz DDR3L-1333 8 W May 2013 AT1250IDJ23HM
A6-1450 4 1.4 GHz 2 MB HD 8250 300 MHz 400 MHz DDR3L-1066 8 W May 2013 AT1450IDJ44HM

1 Unified shaders : Texture mapping units : Render output units

"Kabini" (2013, 28 nm)

Mainstream APU:

Model Step. CPU GPU Memory TDP Released Part Number
Cores Freq. Turbo L2 Cache Mult.1 Vcore Model Config1 Freq. Turbo
E1-2100 B0 2 1.0 GHz — 1 MB HD 8210 128:8:4 300 MHz — DDR3L-1333 9 W May 2013 EM2100ICJ23HM
E1-2500 1.4 GHz HD 8240 400 MHz DDR3L-1333 15 W May 2013 EM2500IBJ23HM
E2-3000 1.65 GHz HD 8280 450 MHz DDR3L-1600 15 W May 2013 EM3000IBJ23HM
A4-5000 4 1.5 GHz 2 MB HD 8330 500 MHz DDR3L-1600 15 W May 2013 AM5000IBJ44HM
A6-5200 2.0 GHz HD 8400 600 MHz DDR3L-1600 25 W May 2013 AM5200IAJ44HM

1 Unified shaders : Texture mapping units : Render output units

Puma (2014)

Mullins, Tablet/2-in-1 APU

Model Stepping CPU GPU Memory
support		 TDP Released Part number
Cores Frequency Turbo L2 Cache Multi1 Vcore Model Config2 Frequency Turbo
E1 Micro-6200T 2 1.0 GHz 1.4 GHz 1 MB 0.50 – 1.40 V R2 128:8:4 300 MHz DDR3L-1066 3.95 W Q2 2014 EM620TIWJ23JB
A4 Micro-6400T 4 1.0 GHz 1.6 GHz 2 MB R3 350 MHz DDR3L-1333 4.5 W Q2 2014 AM640TIVJ44JB
A10 Micro-6700T 1.2 GHz 2.2 GHz 2 MB R6 500 MHz DDR3L-1333 4.5 W Q2 2014 AM670TIVJ44JB

Beema, Notebook APU

Model Stepping CPU GPU Memory
support		 TDP Released Part number
Cores Frequency Turbo L2 Cache Multi1 Vcore Model Config2 Frequency Turbo
E1-6010 2 1.35 GHz — 1 MB 0.50 – 1.40 V R2 128:8:4 350 MHz DDR3L-1333 10 W Q2 2014 EM6010IUJ23JB
E2-6110 4 1.5 GHz 2 MB R2 500 MHz DDR3L-1600 15 W Q2 2014 EM6110ITJ44JB
A4-6210 1.8 GHz R3 600 MHz DDR3L-1600 15 W Q2 2014 AM6210ITJ44JB
A6-6310 1.8 GHz 2.4 GHz R4 800 MHz DDR3L-1866 15 W Q2 2014 AM6310ITJ44JB
A8-6410 2 GHz 2.4 GHz R5 800 MHz DDR3L-1866 15 W Q2 2014

AM6410ITJ44JB

Kaveri (2014)

Model number CPU GPU Memory
support		 TDP Socket Released Part number
Cores Frequency Turbo L2 Cache Multi Vcore Model Config Frequency Turbo
low power
A6-7000 2 2.2 GHz 3.0 GHz 1 MB 22× R4 192:12:4 494 MHz 533 MHz DDR3-1333 17W FP3 June 2014 AM7000ECH23JA
A6 Pro-7050B 553 MHz — AM705BECH23JA
A8-7100 4 1.8 GHz 3.0 GHz 2× 2 MB 18× R5 256:16:4 450 MHz 514 MHz DDR3-1600 19W FP3 June 2014 AM7100ECH44JA
A8 Pro-7150B 1.9 GHz 3.2 GHz 19× 553 MHz — AM715BECH44JA
A10-7300 1.9 GHz 3.2 GHz 19× R6 384:24:8 464 MHz 533 MHz AM7300ECH44JA
A10 Pro-7350B 2.1 GHz 3.3 GHz 21× 553 MHz — AM735BECH44JA
FX-7500 2.1 GHz 3.3 GHz 21× R7 384:24:8 498 MHz 533 MHz FM7500ECH44JA
standard power
A8-7200P 4 2.4 GHz 3.3 GHz 2× 2 MB 24× R5 256:16:4 553 MHz 626 MHz DDR3-1866 35W FP3 June 2014 AM740PDGH44JA
A10-7400P 2.5 GHz 3.4 GHz 25× R6 384:24:8 576 MHz 654 MHz AM740PDGH44JA
FX-7600P 2.7 GHz 3.6 GHz 27× R7 512:32:8 600 MHz 686 MHz DDR3-2133 FM760PDGH44JA

Carrizo-L (2015)

Model Stepping CPU GPU Memory
support		 TDP Released Part number
Cores Frequency Turbo L2 Cache Multi1 Vcore Model Config2 Frequency Turbo
E1-7010 2 1.5 GHz — 1 MB 0.50 – 1.40 V R2 128:8:4 400 MHz DDR3L-1333 10 W May 2015 EM7010IUJ23JB
E2-7110 4 1.8 GHz 2 MB R2 600 MHz DDR3L-1600 12-25 W May 2015 EM7110ITJ44JB
A4-7210 1.8 GHz 2.2 GHz R3 686 MHz DDR3L-1600 12-25 W May 2015 AM7210ITJ44JB
A6-7310 2.0 GHz 2.4 GHz R4 800 MHz DDR3L-1866 12-25 W May 2015 AM7310ITJ44JB
A8-7410 2.2 GHz 2.5 GHz R5 847 MHz DDR3L-1866 12-25 W May 2015 AM7410ITJ44JB

Carrizo (2015)

Model number CPU GPU Memory
support		 TDP Socket Released Part number
Cores Frequency Turbo L2 Cache Multi Vcore Model Config Frequency Turbo
standard power and low power (configurable TDP)
A6-8500P 2 1.6 GHz 3.0 GHz 1 MB 16× R5 256:16:4 800 MHz — DDR3-1600 12-35W FP4 June 2015 AM850PAAY23KA
A6 PRO-8500B 800 MHz — AM850BAAY23KA
A8-8600P 4 1.6 GHz 3.0 GHz 2× 1 MB 16× R6 384:24:8 720 MHz — DDR3-2133 12-35W FP4 June 2015 AM860PAAY43KA
A8 PRO-8600B 1.6 GHz 3.0 GHz 16× 720 MHz — AM860BAAY43KA
A10-8700P 1.8 GHz 3.2 GHz 18× R6 384:24:8 800 MHz — AM870PAAY43KA
A10 Pro-8700B 1.8 GHz 3.2 GHz 18× 800 MHz — AM870BAAY43KA
FX-8800P 2.1 GHz 3.4 GHz 21× R7 512:32:8 800 MHz — FM880PAAY43KA
A12 Pro-8800B 2.1 GHz 3.4 GHz 21× 800 MHz — FM880BAAY43KA

Bristol Ridge (2016)

Model number CPU GPU Memory
support		 TDP Socket Released Part number
Cores Frequency Turbo L2 Cache Multi Vcore Model Config Frequency Turbo
standard power and low power (configurable TDP)
A10-9600P 4 2.4 GHz 3.3 GHz 2× 1 MB R5 384:24:8 720 MHz — DDR4-1866 12–15W FP4 June 2016 AM960PADY44AB
A10-9600B PRO — October 2016 AM960BADY44AB
A10-9630P 2.6 GHz 3.3 GHz 800 MHz — DDR4-2400 25–45W June 2016 AM963PAEY44AB
A10-9630B PRO — October 2016 AM963BAEY44AB
A12-9700P 2.5 GHz 3.4 GHz R7 384:24:8 758 MHz — DDR4-1866 12–15W June 2016 AM970PADY44AB
A12-9700B PRO — DDR4-1866 October 2016 AM970BADY44AB
A12-9730P 2.8 GHz 3.5 GHz 900 MHz — DDR4-2400 25–45W June 2016 AM973PAEY44AB
A12-9730B PRO — October 2016 AM973BAEY44AB
FX-9800P 2.7 GHz 3.6 GHz 512:32:8 758 MHz — DDR4-1866 12–15W June 2016 FM980PADY44AB
A12-9800B PRO — October 2016 AM980BADY44AB
FX-9830P 3.0 GHz 3.7 GHz 900 MHz — DDR4-2400 25–45W June 2016 FM983PAEY44AB
A12-9830B PRO — October 2016 AM983BAEY44AB

"Raven Ridge" (2017)

Model Release
date 		Fab CPU GPU Socket PCIe
lanes 		Memory
support 		TDP
Cores
(threads) 		Clock rate (GHz) Cache Model Config[i] Clock
(MHz) 		Processing
power
(GFLOPS)[ii]
Base Boost L1 L2 L3
Athlon Pro 200U 2019 GloFo
14LP 		2 (4) 2.3 3.2 64 KB inst.
32 KB data
per core 		512 KB
per core 		4 MB Radeon Vega 3 192:12:4
3 CU 		1000 384 FP5 12 (8+4) DDR4-2400
dual-channel 		12–25 W
Athlon 300U Jan 6, 2019 2.4 3.3
Ryzen 3 2200U Jan 8, 2018 2.5 3.4 1100 422.4
Ryzen 3 3200U Jan 6, 2019 2.6 3.5 1200 460.8
Ryzen 3 2300U Jan 8, 2018 4 (4) 2.0 3.4 Radeon Vega 6 384:24:8
6 CU 		1100 844.8
Ryzen 3 Pro 2300U May 15, 2018
Ryzen 5 2500U Oct 26, 2017 4 (8) 3.6 Radeon Vega 8 512:32:16
8 CU 		1126.4
Ryzen 5 Pro 2500U May 15, 2018
Ryzen 5 2600H Sep 10, 2018 3.2 DDR4-3200
dual-channel 		35–54 W
Ryzen 7 2700U Oct 26, 2017 2.2 3.8 Radeon RX Vega 10 640:40:16
10 CU 		1300 1664 DDR4-2400
dual-channel 		12–25 W
Ryzen 7 Pro 2700U May 15, 2018 Radeon Vega 10
Ryzen 7 2800H Sep 10, 2018 3.3 Radeon RX Vega 11 704:44:16
11 CU 		1830.4 DDR4-3200
dual-channel 		35–54 W
  1. ^ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
  2. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Picasso" (2019)

Common features of Ryzen 3000 notebook APUs:

Branding and Model CPU GPU TDP Release
date
Cores
(threads) 		Clock rate (GHz) L3 cache
(total) 		Core
config[i] 		Model Clock
(GHz) 		Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 3780U[18] 4 (8) 2.3 4.0 4 MB 1 × 4 RX Vega 11 1.4 704:44:16
11 CU 		1971.2 15 W Oct 2019
3750H[19] RX Vega 10 640:40:16
10 CU[20] 		1792.0 35 W Jan 6, 2019
3700C[21] 15 W Sep 22, 2020
3700U[a][22] Jan 6, 2019
Ryzen 5 3580U[23] 2.1 3.7 Vega 9 1.3 576:36:16
9 CU 		1497.6 Oct 2019
3550H[24] Vega 8 1.2 512:32:16
8 CU[25] 		1228.8 35 W Jan 6, 2019
3500C[26] 15 W Sep 22, 2020
3500U[a][27] Jan 6, 2019
3450U[28] 3.5 Jun 2020
Ryzen 3 3350U[29] 4 (4) Vega 6 384:24:8
6 CU[30] 		921.6 Jan 6, 2019
3300U[a][31]
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c Model also available as PRO version[32][33][34], released April 8, 2019.

"Renoir" (2020)

U

Branding and model CPU GPU TDP Release
date
Cores
(threads) 		Clock rate (GHz) L3 cache
(total) 		Core
config[i] 		Model Clock
(MHz) 		Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 4980U 8 (16) 2.0 4.4 8 MB 2 × 4 Radeon
Graphics[a] 		1950 512:32:8
8 CU 		1996.8 15 W Apr 13, 2021
4800U 1.8 4.2 1750 1792 Mar 16, 2020
Pro 4750U 1.7 4.1 1600 448:28:8
7 CU 		1433.6 May 7, 2020
4700U 8 (8) 2.0 Mar 16, 2020
Ryzen 5 4680U 6 (12) 2.1 4.0 2 × 3 1500 1344 Apr 13, 2021
Pro 4650U 384:24:8
6 CU 		1152 May 7, 2020
4600U Mar 16, 2020
4500U 6 (6) 2.3
Ryzen 3 Pro 4450U 4 (8) 2.5 3.7 4 MB 1 × 4 1400 320:20:8
5 CU 		896 May 7, 2020
4300U 4 (4) 2.7 Mar 16, 2020
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

H

Branding and model CPU GPU TDP Release
date
Cores
(threads) 		Clock rate (GHz) L3 cache
(total) 		Core
config[i] 		Model Clock
(MHz) 		Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 9 4900H 8 (16) 3.3 4.4 8 MB 2 × 4 Radeon
Graphics[a] 		1750 512:32:8
8 CU 		1792 45 W Mar 16, 2020
4900HS 3.0 4.3 35 W
Ryzen 7 4800H 2.9 4.2 1600 448:28:8
7 CU 		1433.6 45 W
4800HS
Ryzen 5 4600H 6 (12) 3.0 4.0 2 × 3 1500 384:24:8
6 CU 		1152
4600HS[35][36][37] 35 W
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Lucienne" (2021)

Common features of Ryzen 5000 notebook APUs:

Branding and Model CPU GPU TDP Release
date
Cores
(threads) 		Clock rate (GHz) L3 cache
(total) 		Core
config[i] 		Model Clock
(GHz) 		Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 5700U 8 (16) 1.8 4.3 8 MB 2 × 4 Radeon
Graphics
[a] 		1.9 512:32:8
8 CU 		1945.6 10–25 W Jan 12, 2021
Ryzen 5 5500U[38] 6 (12) 2.1 4.0 2 × 3 1.8 448:28:8
7 CU 		1612.8
Ryzen 3 5300U 4 (8) 2.6 3.8 4 MB 1 × 4 1.5 384:24:8
6 CU 		1152
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.

"Cezanne" (2021)

U

Branding and model CPU GPU TDP Release
date
Cores
(Threads) 		Clock rate (GHz) L3 cache
(total) 		Core
config[i] 		Model Clock
(GHz) 		Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 5800U[note 1][39] 8 (16) 1.9 4.4 16 MB 1 × 8 Radeon
Graphics[a] 		2.0 512:32:8
8 CUs 		2048 10–25 W Jan 12, 2021
Ryzen 5 5600U[note 1][40] 6 (12) 2.3 4.2 1 × 6 1.8 448:28:8
7 CUs 		1612.8
5560U[41] 4.0 8 MB 1.6 384:24:8
6 CUs 		1228.8
Ryzen 3 5400U[note 1][42][43] 4 (8) 2.7 4.1 1 × 4
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c d Model also available as Pro version as 5450U,[44] 5650U,[45] 5850U,[46] released on March 16, 2021.

H

Branding and model CPU GPU TDP Release
date
Cores
(Threads) 		Clock rate (GHz) L3 cache
(total) 		Core
config[i] 		Model Clock
(GHz) 		Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 9 5980HX[47] 8 (16) 3.3 4.8 16 MB 1 × 8 Radeon
Graphics[a] 		2.1 512:32:8
8 CUs 		2150.4 35–54 W Jan 12, 2021
5980HS[48] 3.0 35 W
5900HX[49] 3.3 4.6 35–54 W
5900HS[50] 3.0 35 W
Ryzen 7 5800H[51][52] 3.2 4.4 2.0 2048 35–54 W
5800HS[53] 2.8 35 W
Ryzen 5 5600H[54][55] 6 (12) 3.3 4.2 1 × 6 1.8 448:28:8
7 CUs 		1612.8 35–54 W
5600HS[56] 3.0 35 W
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Barceló" (2022)

Branding and model CPU GPU TDP Release
date
Cores
(Threads) 		Clock rate (GHz) L3 cache
(total) 		Core
config[i] 		Model Clock
(GHz) 		Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 7 5825U[note 1][note 2][57] 8 (16) 2.0 4.5 16 MB 1 × 8 Radeon
Graphics[a] 		2.0 512:32:8
8 CUs 		2048 15 W Jan 4, 2022
Ryzen 5 5625U[note 1][note 2][58] 6 (12) 2.3 4.3 1 × 6 1.8 448:28:8
7 CUs 		1612.8
Ryzen 3 5125C[59] 2 (4) 3.0 — 8 MB 1 × 2 ? 192:12:8
3 CU 		? May 5, 2022
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c Model also available as Pro version as 5475U,[60] 5675U,[61] 5875U,[62] released on April 19, 2022.
  2. ^ a b c Model also available as Chromebook optimized version as 5425C,[63] 5625C,[64] 5825C,[65] released on May 5, 2022.

"Rembrandt" (2022)

Common features of Ryzen 6000 notebook APUs:

  • Socket: FP7, FP7r2.
  • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 4.0 lanes.
  • Native USB 4 (40Gbps) Ports: 2
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 2
  • Includes integrated RDNA 2 GPU.
  • Fabrication process: TSMC N6 FinFET.
Branding and model CPU GPU TDP Release
date
Cores
(threads) 		Clock (GHz) L3 cache
(total) 		Core
config[i] 		Model Clock
(GHz) 		Config[ii] Processing
power
(GFLOPS)[iii]
Base Boost
Ryzen 9 6980HX 8 (16) 3.3 5.0 16 MB 1 × 8 680M 2.4 768:48:8
12 CUs 		3686.4 45 W Jan 4, 2022
[66]
6980HS 35 W
6900HX[a] 4.9 45 W
6900HS[a] 35 W
Ryzen 7 6800H[a] 3.2 4.7 2.2 3379.2 45 W
6800HS[a] 35 W
6800U[a] 2.7 15–28 W
Ryzen 5 6600H[a] 6 (12) 3.3 4.5 1 × 6 660M 1.9 384:24:8
6 CUs 		1459.2 45 W
6600HS[a] 35 W
6600U[a] 2.9 15–28 W
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c d e f g h Model also available as PRO version (6650U[67], 6650H[68], 6650HS[69], 6850U[70], 6850H[71], 6850HS[72], 6950H[73], 6950HS[74]), released on April 19, 2022.

Mendocino (7020 series, Zen2/RDNA2 based)

Common features of Ryzen 7020 notebook APUs:

  • Socket: FT6
  • All the CPUs support LPDDR5-5500 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 4 PCIe 3.0 lanes.
  • Native USB 4 (40Gbps) Ports: 0
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 1
  • Includes integrated RDNA 2 GPU.
  • Fabrication process: TSMC N6 FinFET.
Branding and Model CPU GPU TDP Release
date
Cores
(threads) 		Clock rate (GHz) L3 cache
(total) 		Core
config[i] 		Model Clock
(GHz) 		Processing
power[ii]
(GFLOPS)
Base Boost
Ryzen 5 7520U[iii] 4 (8) 2.8 4.3 4 MB 1 × 4 610M
2 CU 		1.9 486.4 15 W September 20, 2022[75]
Ryzen 3 7320U[iii] 2.4 4.1
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  3. ^ a b Model also available as Chromebook optimized version as 7520C[76] and 7320C[77] released on May 23, 2023


Barcelo-R (7030 series, Zen3/GCN5 based)

Common features of Ryzen 7030 notebook APUs:

  • Socket: FP6.
  • All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 3.0 lanes.
  • Native USB 4 (40Gbps) Ports: 0
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 2
  • Includes integrated GCN 5th generation GPU.
  • Fabrication process: TSMC N7 FinFET.
Branding and Model CPU GPU TDP Release
date
Cores
(threads) 		Clock rate (GHz) L3 cache
(total) 		Core
config[a] 		Model Clock
(GHz) 		Processing
power[b]
(GFLOPS)
Base Boost
Ryzen 7 (PRO) 7730U 8 (16) 2.0 4.5 16 MB 1 × 8 Vega
8 CU 		2.0 2048 15 W January 4, 2023
[78]
Ryzen 5 (PRO) 7530U 6 (12) 1 × 6 Vega
7 CU 		1792
7430U 2.3 4.3 1.8 1612.8 Q4 2023
Ryzen 3 (PRO) 7330U 4 (8) 8 MB 1 × 4 Vega
6 CU 		1382.4 January 4, 2023
[79]
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Rembrandt-R (7035 series, Zen3+/RDNA2 based)

Common features of Ryzen 7035 notebook APUs:

  • Socket: FP7, FP7r2.
  • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 4.0 lanes.
  • Native USB 4 (40Gbps) Ports: 0
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 2
  • Includes integrated RDNA 2 GPU.
  • Fabrication process: TSMC N6 FinFET.
Branding and model CPU GPU TDP Release
date[80]
Cores
(threads) 		Clock (GHz) L3 cache
(total) 		Core
config[a] 		Model Clock
(GHz) 		Processing
power[b]
(GFLOPS)
Base Boost
Ryzen 7 7735HS 8 (16) 3.2 4.75 16 MB 1 × 8 680M
12 CU 		2.2 3379.2 35–54 W April 30, 2023
7735H
7736U 2.7 4.7 15–28 W January 4, 2023
7735U 4.75 15–30 W
7435HS 3.1 4.5 — 35–54 W 2024[81]
7435H
Ryzen 5 7535HS 6 (12) 3.3 4.55 1 × 6 660M
6 CU 		1.9 1459.2 April 30, 2023
7535H
7535U 2.9 15–30 W January 4, 2023
7235HS 4 (8) 3.2 4.2 8 MB 1 × 4 — 35–53 W 2024[82]
7235H
Ryzen 3 7335U 3.0 4.3 660M
4 CU 		1.8 921.6 15–30 W January 4, 2023
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Phoenix (7040 series, Zen4/RDNA3 based)

Common features of Ryzen 7040 notebook APUs:

  • Socket: FP7, FP7r2, FP8.
  • All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • All models support AVX-512 using a half-width 256-bit FPU.
  • PCIe 4.0 support.
  • Native USB 4 (40Gbps) Ports: 2
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 2
  • Includes integrated RDNA 3 GPU.
  • Includes XDNA AI Engine (Ryzen AI).
  • Fabrication process: TSMC N4 FinFET.
Branding and model CPU GPU NPU PCIe
(lanes) 		TDP Release
date[83]
Cores
(threads) 		Clock (GHz) L3 cache
(total) 		Core
config[a] 		Model Clock
(GHz)
Total Zen 4 Zen 4c Base Boost
Ryzen 9 (PRO) 7940HS 8 (16) 8 (16) — 4.0 5.2 16 MB 1 × 8 780M
12 CU 		2.8 Ryzen AI
Up to 10 TOPS 		20 35–54 W April 30, 2023[b]
7940H[c]
Ryzen 7 (PRO) 7840HS 3.8 5.1 2.7
7840H[c]
(PRO) 7840U 3.3 15–30 W May 3, 2023[b]
Ryzen 5 (PRO) 7640HS 6 (12) 6 (12) 4.3 5.0 1 × 6 760M
8 CU 		2.6 35–54 W April 30, 2023[b]
7640H[c]
(PRO) 7640U 3.5 4.9 15–30 W May 3, 2023[b]
(PRO) 7545U 2 (4) 4 (8) 3.7 / 3.0[d] 4.9 / 3.5[e] 2 + 4 740M
4 CU 		2.8 No 14 November 2, 2023
(PRO) 7540U 6 (12) — 3.2 4.9 1 × 6 2.5 May 3, 2023[b]
Ryzen 3 7440U 4 (8) 1 (2) 3 (6) 3.6 / 2.8[d] 4.7 / 3.3[e] 8 MB 1 + 3
  1. ^ Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores
  2. ^ a b c d e PRO versions launched on 13 June 2023.
  3. ^ a b c China-only version of the HS SKU that lacks support for AMD EXPO and FreeSync technologies.
  4. ^ a b Zen 4 cores' base frequency / Zen 4c cores' base frequency
  5. ^ a b Zen 4 cores' boost frequency / Zen 4c cores' boost frequency

Dragon Range (7045 series, Zen4/RDNA2 based)

Common features of Ryzen 7045 notebook CPUs:

  • Socket: FL1.
  • All the CPUs support DDR5-5200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • All the CPUs support 28 PCIe 5.0 lanes.
  • Native USB 4 (40Gbps) Ports: 0
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 4
  • Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost)[i].
  • Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O and graphics die).
Branding and model Cores
(threads) 		Clock (GHz) L3 cache
(total) 		Chiplets Core
config[a] 		TDP Release
date[84]
Base Boost
Ryzen 9 7945HX3D 16 (32) 2.3 5.4 128 MB[ii] 2 × CCD
1 × I/OD 		2 × 8 55–75 W July 27, 2023
7945HX 2.5 64 MB February 28, 2023
7940HX 2.4 5.2 January 17, 2024
7845HX 12 (24) 3.0 5.2 2 × 6 45–75 W February 28, 2023
Ryzen 7 7840HX 2.9 5.1 January 17, 2024
7745HX 8 (16) 3.6 5.1 32 MB 1 × CCD
1 × I/OD 		1 × 8 February 28, 2023
Ryzen 5 7645HX 6 (12) 4.0 5.0 1 × 6
  1. ^ Core Complexes (CCX) × cores per CCX
  1. ^ Self identifies as "AMD Radeon 610M". See RDNA 2 § Integrated graphics processors (iGPs).
  2. ^ Only one of the two CCXes has additional 64 MB of 3D V-Cache. Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower.

See also

References

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