Mini Small Outline Package

A surface-mount IC in the MSOP form-factor

The Mini Small Outline Package (MSOP) is a miniaturized version of the small outline integrated circuit packaging format for integrated circuits.

Application

Many integrated circuits are available in the MSOP form factor. They are suited for space-limited applications requiring 1 mm or less mounted height and are commonly used in disk drives, video/audio and consumer electronics.^[1]

Physical properties

The size of the Mini Small Outline Package is only 3mm × 3mm for the 8 and 10 pin versions^[1] and 3mm × 4mm for the 12 and 16 pin version.^[2]^[3] The small package offers a small footprint, short wires for improved electrical connections, and good moisture reliability.^[1] Some versions have an exposed pad on the bottom side. The exposed pad will be soldered on the PCB to transfer heat from the package to the PCB.^[2]^[1]

Package	Pins	Body width (mm)	Body length (mm)	Lead pitch (mm)
MSOP8	8	3	3	0.65
MSOP10	10	3	3	0.5
MSOP12	12	3	4	0.65
MSOP16	16	3	4	0.5

Synonyms

μMAX or micro max - Maxim name for the MSOP package.^[4]^[2]
μMAX-EP or micro max exposed pad - Maxim name for the MSOP package with exposed pad.^[2]^[4]
MSE - Linear Technology name for the MSOP package with exposed pad.^[2]